The Creep of Wires at High Temperature

Abstract

This paper describes apparatus developed to make creep tests on wires at high temperatures in a vacuum, and the results of a series of creep tests on wires of an alloy known as Konal at temperatures of from 800 to 1000°C. It is shown that Ludwik's logarithmic law connecting rate of deformation and stress holds for higher creep rates and stresses, although it certainly does not hold for the lower creep rates and stresses. In the range of temperatures tested, it is found that a linear relation best expresses the variation of the logarithm of the minimum creep rate with temperature. The method used is suggested as being readily adaptable to the making of short time creep tests, for obtaining comparative creep data in a relatively short time on materials used at high temperatures.