Abstract
The higher order crack tip fields for an anti-plane crack in functionally graded piezoelectric materials (FGPMs) under mechanical and electrical loadings are studied. Different from previous analyses, all material properties of FGPMs are assumed to be linear functions of x parallel to the crack. The boundary conditions on crack surfaces are assumed to be the stress free and electrically impermeable. By using the eigen-expansion method, the problem is reduced to solving the system of ordinary differential equations. The higher order stress and electric displacement crack tip fields for FGPMs are obtained by solving the ordinary differential equations.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
