Abstract
Scanning acoustic microscopy was used to characterize the micro-voids distribution for specimens in non-destructive mode. In addition, the in-situ scanning electron microscopy observation was performed during tensile deformation of high-pressure die-cast (HPDC) of AM50 alloy to obtain the mechanism of fracture induced by micro-voids. The effects of micro-voids on the mechanical properties were discussed. The results obtained from the examination suggest that fracture tends to occur at bigger micro-voids or in the cluster micro-voids area.
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