Abstract
AbstractThe chemical etching of W(100) single crystals and polycrystalline tungsten foils using a XeF2 molecular beam has been studied with and without simultaneous bombardment by energetic inert ions.The surface fluorine concentration, measured under different XeF2 pressures (10−7 to 10−5 torr) and ion current densities, is found to be always less than a monolayer.Depth profiles of the fluorine layer show that in both single crystal and poly samples, the fluorine is surface localized, although slightly deeper in the W(100).A kinetic model is presented to account for the enhanced etching under ion bombardment.The mechanism proposed is mainly a defect driven enhancement of the etch yield.This model is consistent with both the fluorine concentrations measured in this work as well as the etch product yields reported by Winters.
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