The characteristics and residual stress of aluminum nitride films grown by two-stage sputtering of mid-frequency power

Abstract

The [0 0 2] oriented aluminum nitride has a high surface acoustic wave speed and high mechanic-electron couple coefficient. It is a potential material for manufacturing piezoelectric devices in high frequency application. The AlN films deposited onto silicon substrates were fabricated by two-stage sputtering process with mid-frequency generator. The results showed that the film did not have well [0 0 2] preferred orientation at 1.0 and 1.5 kW, and exhibited a [0 0 2] preferred orientation at 2.0 kW. The adhesion was poor when the film had a high preferred orientation because the substrate was damaged by high energetic atoms bombardment. A two-stage growth method was investigated in order to get high [0 0 2] preferred orientation and good adhesion. A good performance was obtained at the first stage power of 1.5 kW and the second stage power of 2.0 kW. The film showed a tensile stress state when the film was deposited at 1.0 kW. In contrast, the stress state was changed to compressive when the films were grown at 2.0 kW. The two-stage growth could succeed not only to get a high [0 0 2] preferred orientation but also to develop a reducing global stress film.