The Characteristic of Formation CoSi2/Si Thin Film by the RF-Sputtering Method

Abstract

In this paper, the thin films with thicknesses of about were deposited on n-type silicon (111) substrates by RF magnetron sputtering method using a target (99.99%). The flow rate of argon of 50 sccm, substrate temperature of , RF power of 60 watts, deposition time of 30 minutes, and the vacuum of Torr. The annealing treatments of the thin film were performed from 500, 700 and for 1h in air ambient by an electric furnace. In order to investigate the thin film X-ray diffraction patterns were measured using the X-ray diffractometer (XRD). The structure of the thin films were investigated by using scanning the electron microscope (SEM) were used for review. The surface morphology of the thin films was measured with a atomic force microscopy (AFM). Temperature dependence of sheet resistivity and property of Hall effect was measured in the thin film.