The changes in morphology of Si(1 0 0) surface upon dipping in ultrapure water

Abstract

The changes in morphology and chemical states of Si(1 0 0) surface upon dipping in ultrapure water were investigated by using atomic force microscope and X-ray photoelectron spectroscopy. The oxidation and the etching competitively progressed at the HF-treated Si(1 0 0) surface in ultrapure water, which made the smooth surface rough. However, the surface covered with a thick native oxide film was not etched at all. During the repetition of the oxidation and the etching, the SiO 2-nuclei was, by chance, able to grow up to some size of islands and worked as the protective barrier against the water etching. Thus, the SiO 2-islands would remain without being etched off, whereas rest parts of the surface could be etched off. This selective etching leads the surface morphology to become rough. Both the oxidation and the etching progressed violently as the water temperature and the dipping time increased.