Abstract

Brittle non-conductive materials, like glass and ceramics, are becoming ever more significant with the rising demand for fabricating micro-devices with special micro-features. Spark-Assisted Chemical Engraving (SACE), a novel micromachining technology, has offered good machining capabilities for glass and ceramic materials in basic machining operations like drilling, milling, cutting, die sinking, and others. This paper presents a review about SACE technology. It highlights the process fundamentals of operation and the key machining parameters that control it which are mainly related to the electrolyte, tool-electrode, and machining voltage. It provides information about the gas film that forms around the tool during the process and the parameters that enhance its stability, which play a key role in enhancing the machining outcome. This work also presents the capabilities and limitations of SACE through comparing it with other existing micro-drilling and micromachining technologies. Information was collected regarding micro-channel machining capabilities for SACE and other techniques that fall under four major glass micromachining categories—mainly thermal, chemical, mechanical, and hybrid. Based on this, a figure that presents the capabilities of such technologies from the perspective of the machining speed (lateral) and resulting micro-channel geometry (aspect ratio) was plotted. For both drilling and micro-channel machining, SACE showed to be a promising technique compared to others as it requires relatively cheap set-up, results in high aspect ratio structures (above 10), and takes a relatively short machining time. This technique shows its suitability for rapid prototyping of glass micro-parts and devices. The paper also addresses the topic of surface functionalization, specifically the surface texturing done during SACE and other glass micromachining technologies. Through tuning machining parameters, like the electrolyte viscosity, tool–substrate gap, tool travel speed, and machining voltage, SACE shows a promising and unique potential in controlling the surface properties and surface texture while machining.

Highlights

  • The evolution of micro-technology has vastly extended the frontiers of micromachining and its capabilities

  • Microfluidic devices, micro-pumps, and micro-reactors, to name a few, are microelectromechanical system (MEMS) devices that depend on the micromachining technology of several non-conductive materials like glass, ceramics, and composites [6]

  • These results showed an increase in materials removal rate (MRR)

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Summary

Introduction

The evolution of micro-technology has vastly extended the frontiers of micromachining and its capabilities. Despite the existence of other machining technologies including mechanical, chemical, and thermal, SACE has advantages over other processes used for micromachining non-conductive materials. Other review papers exist on the topic [27,28], this paper is a detailed review identifying the advantages as well as limitations of SACE compared to other mmiiccrroommachining techniques in tteerrmmss ooff ddrriilllliinngg aanndd mmaacchhiinniinngg. This revealed insights on the position of SACE ffrroom aa ccoommppaarraattiivvee ppeerrssppeective wwith ootthheer mmiiccrroommachining technologies.

Gravity-Feed Machining
Constant Velocity-Feed Machining
The Electrolyte
Electrolyte Material
Electrolyte Concentration
Tool-Electrode
Tool-Electrode Material
Tool-Electrode GeometryGlass
TTool-Electrode Rotational Speed
Tool-Electrode Rotational Speed
CSuerrafamceicQsuality and Machining Speed
Surface Functionalization
Findings
Conclusions and Outlook

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