Abstract

The advantages of laser material processing have now been combined with those of water-jet cutting for the first time, yielding a radical new process available today for industrial applications. This revolutionary principle involves bundling and guiding a laser beam (Nd:YAG) in a laminar water jet with a diameter of only two mils (50 microns). “Microjet®” (as the process is called) can be used for the cutting, drilling, ablation and surface structuring of metals, ceramics, plastics, composites and semiconductor materials with an outstanding degree of quality. Its ample working distance of up to 4 inches makes the laser unarguably suitable for countless new applications in the field of micro processing - applications which cannot be realized with conventional laser systems on account of their beam geometric and the requisite focusing on the work piece. What’s more, the potential applications are further expanded by the fact that the thermal influence of Microjet is quite negligible and the process results in extraordinarily precise cut edges. It’s no wonder Synova reports the industry showing a keen interest in the Microjet, within the fields of microelectronics and surface treatment, the watchmaking industry, aerospace and automotive industries in particular, all harboring high hopes for the new technology.“Microjet” is based on an internationally patented material processing technology that has already received numerous awards: a laser beam is guided onto the work piece inside a water jet, with the wave being conducted in the water jet via the total reflection that takes place at the interface between water and air, in a manner similar to conventional glass fibers. The water jet can thus be referred to as a variable-length fluid optical wave-guide.The advantages of laser material processing have now been combined with those of water-jet cutting for the first time, yielding a radical new process available today for industrial applications. This revolutionary principle involves bundling and guiding a laser beam (Nd:YAG) in a laminar water jet with a diameter of only two mils (50 microns). “Microjet®” (as the process is called) can be used for the cutting, drilling, ablation and surface structuring of metals, ceramics, plastics, composites and semiconductor materials with an outstanding degree of quality. Its ample working distance of up to 4 inches makes the laser unarguably suitable for countless new applications in the field of micro processing - applications which cannot be realized with conventional laser systems on account of their beam geometric and the requisite focusing on the work piece. What’s more, the potential applications are further expanded by the fact that the thermal influence of Microjet is quite negligible and the process results ...

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