Abstract
Spiral flow is one of the most important standard tests for thermosetting encapsulation molding compound (EMC), which dominate the mold flow behavior during semiconductor molding process. To improve mold flow simulation accuracy, spiral flow simulation by Moldex3D and then compare with actual EMC spiral flow testing result was performed in this study. However, the numerical simulation result is always showing some gap with actual spiral flow testing data, which also mean that the mold flow simulation of general semiconductor molding process has some incorrect issue. In this study, the inputs for spiral flow simulation are reviewed in detail, both the material measurement issues and the mold flow simulation mechanism issues were considered to improve the simulation results to match with actual spiral flow testing data. Different kinds of materials are also evaluated and compare the spiral flow testing data under different process conditions. This study will provide a more comprehensive knowledge and understanding to improve benchmarking procedures.
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