Abstract

The ATLAS experiment at the Large Hadron Collider is currently preparing major detector upgrades to meet the requirements of the High Luminosity LHC (HL-LHC), scheduled to begin in 2026. With the radiation damage and high density of tracks expected at the HL-LHC, the current Inner Detector would be inoperable, and will instead be replaced by an all-silicon Inner Tracker (ITk). The ITk consists of two sub-systems: a pixel detector close to the beam pipe, and a strip detector at larger radii. This paper presents results from an extensive design and prototyping effort for the ITk strip detector, including studies of the sensors, electronics, and support structures. The performance of the detector has been validated through testbeams, simulations, and thermal and electrical prototypes. Plans for the forthcoming production phase are also presented.

Highlights

  • The ATLAS detector at the Large Hadron Collider has been operating successfully for nearly a decade, recording more than 175 fb−1 of pp collision data

  • From 2024 to 2026, the LHC will be upgraded to the High Luminosity LHC (HL-LHC), which is expected to deliver instantaneous luminosity up to 7.5×1034 cm−2s−1, and an integrated luminosity up to 4 ab−1 per experiment

  • The pileup will reach an average of 200 interactions per bunch crossing, and hadron fluences of up to 2×1016 neq∕cm2 will cause significant radiation damage

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Summary

Introduction

The ATLAS detector at the Large Hadron Collider has been operating successfully for nearly a decade, recording more than 175 fb−1 of pp collision data. From 2024 to 2026, the LHC will be upgraded to the High Luminosity LHC (HL-LHC), which is expected to deliver instantaneous luminosity up to 7.5×1034 cm−2s−1, and an integrated luminosity up to 4 ab−1 per experiment. This will provide unprecedented opportunities for precise measurements in the Higgs and electroweak sectors, as well as searches for physics beyond the Standard Model. The pixel detector consists of five barrel layers, with inclined sensors in the forward region, as well as an endcap with individually located rings. With increased granularity, reduced material, and more radiation-hard sensors, the ITk is expected to maintain or improve the tracking performance in spite of the more challenging environment

Sensors and modules
ASICs and electronics
Support structures
Testbeams
Thermal studies
Electrical staves
Preparations for production
Findings
Conclusion
Full Text
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