The application of the moment equilibrium model to the offset of pressure center of trimming progressive die in IC packaging machine

Abstract

This study constructs three modules to the trimming progressive die, including upper die module, bottom die module and strip pulling system module, based on the modularized characteristic of trimming progressive die in each IC packaging machine. By using the concept of the modulization and combining the principle of moment equilibrium, it could be found that the center-of-gravity position of trimming progressive die can be quickly and effectively generated in this study. Moreover, by applying the simulated annealing method to calculate the moment equilibrium of trimming progressive die of IC packaging machine with the minimum deviation of the moment can acquire more suitable arrangement ways of punch work stations of trimming progressive die of IC packaging machine. In a case study, the arrangement ways of punch work stations provided by the theoretical model in this study are superior to the arrangement way applied by an industry’s case. In the aspect of decreasing the moment, this study provides an improvement by 11%. This study proposed the above-mentioned moment equilibrium model to the offset of pressure center of the trimming progressive die in the IC packaging machine, it can short the adjusting time for the moment equilibrium of punch forces which differs from the traditional method in the past that the pressure center of trimming progressive die had to be obtained by gradual and slow adjustment.