Abstract
Due to their high density, dielectric ceramics are no longer appropriate for the areas with a light weight demand such as aeronautics, astronautics and wearable devices. In order to meet the ever-increasing demand for lightweight and flexibility dielectric composites, an organic semiconductor material linear polyethylene glycol-polyaniline multi-alternating block (more than triblock) copolymer (with low density) was designed based on the Williamson ether synthesis. FT-IR, 1HNMR, XRD, DSC and TG results confirmed the success of the synthesis. Its SEBS-based dielectric composites behavior was studied. The results indicated that the copolymer not only possessed a lighter density (~0.9 g/cm3) compared with ceramics (~6–8 g/cm3), but also exhibited better dielectric performances as a dielectric filler. The dielectric constant was 14.52 at a content of 11.5 vol% and the breakdown strength was 33.12 KV·mm−1, compared to ceramic BaTiO3 composite having 9.03 and 20.09 KV·mm−1
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