The application of multi-scale simulation in advanced electronic packaging

Abstract

Electronic packaging is an essential branch of electronic engineering that aims to protect electronic, microelectronic, and nanoelectronic systems from environmental conditions. The design of electronic packaging is highly complex and requires the consideration of multi-physics phenomena, such as thermal transport, electromagnetic fields, and mechanical stress. This review presents a comprehensive overview of the multiphysics coupling of electric, magnetic, thermal, mechanical, and fluid fields, which are crucial for assessing the performance and reliability of electronic devices. The recent advancements in multi-scale simulation techniques are also systematically summarized, such as finite element methods at the macroscopic scale, molecular dynamics and density functional theory at the microscopic scale, and particularly machine learning methods for bridging different scales. Additionally, we illustrate how these methods can be applied to study various aspects of electronic packaging, such as material properties, interfacial failure, thermal management, electromigration, and stress analysis. The challenges and the potential applications of multi-scale simulation techniques in electronic packaging are also highlighted. Further, some future directions for multi-scale simulation techniques in electronic packaging are concluded for further investigation.