The Anomalies in Temperature Dependence of the Yield Stress of Cu Base Solid Solutions

Abstract

Yield stress of Cu and Cu base solid solutions is measured from room temperature down to 1.6 K. Two kinds of anomalous behavior of the yield stress of the solid solutions are observed below 50 and 10 K. From theoretical considerations, these anomalies are attributed to dynamical motion of dislocation and to dynamical production of point defects due to climb motion of the dislocation, respectively. Hysteresis behavior of the temperature dependence of the yield stress, which is due to the dynamically produced point defects, is observed in very low temperature region. Criterion for applicability of chemical rate process to the motion of dislocation is discussed.