Abstract
Piezoelectric ceramics have been attracted much attention as one of important elements of smart structures in recent years. They are often subjected to severe temperature environment and, due to their brittleness, tend to develop cracks under thermal load. Therefore, evaluation of thermal effect on the cracks in a piezoelectric body is very important and the problems of the cracks within the body are treated by many researchers. Lu, Tan and Liew [1] studied a two-dimensional piezoelectric material with an elliptic cavity under a uniform heat flow. Shen and Kuang [2] presented interface cracks in bi-piezothermoelastic media and the interaction with a point heat source. Wang and Noda [3] discussed fracture of a piezoelectric material strip under steady thermal load, and investigated thermally induced fracture of a smart functionally graded composite structure [4].
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