Abstract
A new method is developed to evaluate the adhesion properties of thin films. This method is based on a composite hardness model. In our experiments, Cu films which were deposited on Si and glass substrates by pulsed laser ablation were indented and scratched by a Vickers microhardness tester and a diamond cutter, respectively. It was found that adhesion influenced the micro-hardness of films for soft films deposited on hard substrates. This result was explained by the elastic–plastic deformation mode of indentation.
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