Abstract

Multifilamentary microcomposite copper-niobium (Cu-Nb) wires were fabricated by a series of accumulative drawing and bonding steps (ADB). The texture of the Cu matrix in these wires was studied using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). Dynamic recrystallization during cold drawing caused a weakening of the <111> texture in the micron-scale Cu matrix at high values of true strain. A sharp <111> texture was observed in the nano-scale Cu matrix due to the suppression of dynamic recrystallization. The grain size was reduced by the higher level of dynamic recrystallization at high strains. The relation between the nanoindentation behavior of the different Cu matrix and the grain sizes, Cu-Nb interface, and texture was established.

Highlights

  • Over the past two decades, Cu-Nb microcomposites have been widely used in defense, aerospace, and magnetic applications for their excellent combination of mechanical properties, high conductivity, and thermal stability [1,2,3,4]

  • electron backscattered diffraction (EBSD) specimens were cut from the ADB wires, and electron polished in a solution of

  • The 854 Nb fibers were embedded in a Cu matrix with five different spacings of Cun : from the largest outer-most jacket (n = 0) to the finest nanoscale

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Summary

Introduction

Over the past two decades, Cu-Nb microcomposites have been widely used in defense, aerospace, and magnetic applications for their excellent combination of mechanical properties, high conductivity, and thermal stability [1,2,3,4]. The ADB process enables the production of Cu-Nb microcomposite wires more than 100 m in length [14]. During this process, a multi-scale Cu matrix with grain sizes ranging from a few microns to a few nanometers is formed [15]. Metals experiencing axisymmetric deformation after ADB will develop a fiber texture and only one direction is needed to fully represent the preferred orientation [16,17]. The large number of embedded Nb fibers affects the deformation and texture development of the Cu matrix [18]. A variety of constraints, including the Cu-Nb interface area and the matrix dimensions, will alter the deformation compared to non-composite

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