Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature

Abstract

Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s −1, for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin 2 ψ technique. The components of the stress tensor were obtained using measurements at three different φ angles of 0°, 45° and 90°. The crystallite sizes as a function of substrate temperature and ψ angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with ψ angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed.