Abstract

Boron nitride thin films were deposited on different bottom electrodes (BE) by radio frequency (RF) magnetron sputtering. Morphology and structure of films were characterized by atomic force microscopy (AFM) and X-ray diffraction (XRD); Electric properties of BN films were investigated by piezoresponse force microscopy (PFM) and current sensing atomic force microscopy (CSAFM). XRD results show that cubic BN (cBN) film was deposited on copper under an optimized process parameter. The cBN film with a flat surface and uniform particles was confirmed by AFM. In the case of copper electrode, cBN film shows obviously piezoelectric properties. The other two did not show any piezoelectric properties. All the results suggest that cBN on Cu electrode will be one of the promising piezoelectric materials.

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