Abstract
AbstractTextural evolution of Cu interconnects having a different line width was investigated after annealing. Texture was measured on the surface of Cu interconnects using EBSD (electron backscattered diffraction) techniques including GBCD (grain boundary character distribution). To analyze a relationship between the stress distribution and textural evolution in the samples investigated, the micro stresses were calculated for the different line width at 200°C using FEM (finite element modeling). In this investigation, it was found that the inhomogeneity of stress distribution in Cu interconnects is an important factor is necessary for understanding textural transformation after annealing. A new interpretation of textural evolution in damascene interconnects lines after annealing is suggested, based on the state of stress and the growth mechanisms of Cu electrodeposits.
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