Abstract
Too complex to be tested as a chip and too packaged to be probed like a board, the multichip module presents a new set of challenges to the test engineer. The author describes how, until dedicated testers are developed, applying board-type tests using an IC tester will prove to be the most effective test methodology.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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