Abstract
This chapter discusses the testing of MEMS devices as well as the techniques and structures that enable testing. The chapter begins with a discussion of the need for testing which is related to the reality of imperfect fabrication and packaging processes. Parametric test structures encompassing a wide variety of MEMS technologies are discussed because they provide a means to monitor the fabrication and packaging process. Self testing techniques and test points provide a means to evaluate the performance of a device. During the packaging and assembly process, devices are often tested and then modified by trimming. After assembly, burn-in and reliability testing are often performed. These tests are often dependent on acceleration factors such as those described in the Arrhenius model. The chapter concludes with a discussion of testing of packaged MEMS devices in the field.
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