Abstract

The accuracy of high-speed wafer-level measurements on digital IC's is limited by the probe interface. This limitation strongly encourages the use of built-in on-chip test hardware to reduce the number of critical off-chip high-speed interfaces. A novel synchronous propagation delay test structure is described which will provide accurate parametric data under typical automatic test conditions. Built-in test features added to complex combinational circuits are shown which are useful for delay measurement and which reduce the total number of high-speed I/O connections while still providing acceptable fault coverage in many cases.

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