Test Research on the Surface Residual Stress of Dimensional Ultrasonic Vibration Grinding for Al<sub>2</sub>O<sub>3</sub>/ZrO<sub>2(n)</sub>

Abstract

Based on the research for the structure of the ceramic nanocomposites’ intragranular for Al2O3/ZrO2(n)，we did the test by the workpiece two-dimensional vibration grinding(WTDUVG), and focus on analyzing the characteristic and the effect element of the two-dimensional ultrasonic vibration grinding ceramic surface residual stress by the XRD diffraction. The result show that ceramic dimensional ultrasonic vibration grinding surface tensile stress is less than the same conventional grinding (CG) surface under tensile stress; two-dimensional ultrasonic vibration grinding surface residual compressive stress than conventional ground surface residual stress under the same grinding. Material removal mechanism of the grinding nature of the surface residual stress, when the material removaled by ductile deformation, grinding surface equal residual stress; when the material removaled by brittle- ductile mixed mode, the grinding surface tensile stress reduced, because the fracture of the ground surface, tensile stress released. As a results, the grit size of grinding wheel, Grinding depth and workpiece mechanical properties are the main technology factors affected the nature and size of the residual stress of ground surface.