Abstract
Test data compression became an active research topic in the late 1990s, and has now become a standard offering within commercial DFT solutions. This issue of IEEE Design & Test features a special issue on the current state of test compression. This issue of D&T also concludes the theme of design and test of RFIC chips (featured in the Jan./Feb. 08 issue), with two additional articles. In addition, this issue features two general-interest articles and an interview with DRAM inventor Bob Dennard.
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