Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties

Branislav Radomir Marković,Aleksandra Patarić,Dragan Manasijević,Miroslav Sokić,Nadežda Talijan,Mladen Bugarčić,Nada Štrbac

doi:10.30544/316

Abstract

The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.

Highlights

The high toxicity of lead and damaging effects on the environment result in the prohibited use of the electronic materials (RoHS Directive from 1 July 2006 in the EU)
The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3
These samples were experimentally investigated using differential scanning calorimetry (DSC) and scanning electron microscopy with energy dispersive spectrometry (SEM-EDX), while mechanical and electrical investigations were performed along all three sections from the bismuth corner, with molar ratio Cu:Ni = 1:1, Cu:Ni = 3:1 and Cu:Ni = 1:3

Summary

Introduction

The high toxicity of lead and damaging effects on the environment result in the prohibited use of the electronic materials (RoHS Directive from 1 July 2006 in the EU). The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.

Results

Conclusion