Tension-induced softening and hardening in gradient nanograined surface layer in copper

Abstract

With surface mechanical grinding treatment, a gradient nanograined (GNG) surface layer is produced on a bulk coarse-grained (CG) pure Cu, where the grain size increases gradually from 20 nm (topmost surface) to micrometer scale. Microhardness measurements of the GNG/CG sample after tension revealed that tension induces softening for grains smaller than 165 nm and induces hardening above this size. This critical size agrees with the strain-induced saturation grain size of Cu subjected to severe plastic deformation.