Tensile-Strained GeSn Metal–Oxide–Semiconductor Field-Effect Transistor Devices on Si(111) Using Solid Phase Epitaxy

Abstract

We demonstrate tensile-strained GeSn metal–oxide–semiconductor field-effect transistor (MOSFET) devices on Si(111) substrates using solid phase epitaxy of amorphous GeSn layers. Amorphous GeSn layers are obtained by limiting the adatom surface mobility during deposition. Subsequent annealing transforms the amorphous layer into single-crystalline GeSn by solid phase epitaxy. Single-crystalline GeSn layers with 4.5% Sn and 0.33% tensile strain are fabricated on Si(111) substrates. To verify the structural quality of thin-film GeSn as a channel material, we fabricate ultrathin GeSn p-channel MOSFETs (pMOSFETs) on Si(111). We demonstrate junctionless depletion-mode operation of tensile-strained GeSn(111) pMOSFETs on Si substrates.