Abstract
A new type of tensile tester for sub-micrometer thick films has been developed. The tester has a grip that allows chucking one end of a thin-film specimen by electrostatic force while the other end is fixed to a silicon substrate. It uses a servo-controlled balance for small-force measurement. Sub-micrometer thick single-crystal-silicon specimens were fabricated using bulk micromachining starting with a SIMOX wafer. The specimens were 0 to 500 μm long, 20 or 50 μm wide and 0.14 μm thick. Young’s modulus is 158 GPa, which is measured using the differential stiffness method. The tensile strength ranged from 1.4 to 4.9 GPa for 12 samples; the large distribution of the tensile strength is observed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
