Tensile testing of ultrathin polycrystalline films: A synchrotron-based technique

Abstract

The mechanical properties of metallic thin films on the nanoscale acquire increasingly more importance as applications in microelectromechanical systems/NEMS as well as microelectronics have reached this size scale. Here, we present a synchrotron x-ray diffraction technique by which it is possible to characterize the evolution of mechanical stress in a metallic film thinner than 100 nm at measurement times shorter than 60 s per data point. This high data acquisition rate is achieved because no relative motions or tilting of specimen, x-ray source and detector (a large-area charge coupled device camera) are required. The technique comprises an initial “sin2 ψ” measurement to establish the absolute stress values followed by periodic “sin2 φ” measurements during straining to determine stress increments. We describe an experimental setup established at the synchrotron radiation source ANKA (Karlsruhe, Germany) which is specifically suited for monitoring the stress evolution during in situ tensile tests on thin films deposited on compliant polymeric substrates. First stress-strain curves, measured in this way, for a 40-nm-thick gold film are presented.