Abstract
In this article, the tensile properties of low Ag lead-free solder alloys, SAC0307 and SAC105, are examined under various strain rates and temperatures. The wettability of these solders on Cu pad is also characterized by using different fluxes. The SAC305 and Sn37Pb solder alloys are also studied for comparison. Our results show that the properties of all solder alloys are dependent on the strain rate and temperature. The ultimate tensile strength increases monotonously with the increment of strain rate. Both SAC0307 and SAC105 alloys possess lower strength and higher elongation ratio than SAC305 and Sn37Pb alloys. For all the fluxes used in this study, the SAC0307 and SAC105 alloys show the similar wettability to SAC305, whereas worse than that of Sn37Pb alloy. Increasing the activity of the flux does not improve the wettability of the SAC solder alloys on Cu pad effectively.
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