Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation

Abstract

Sn5%Sb is one of the materials considered for replacing lead containing alloys for soldering in electronic packaging. We evaluated the tensile properties of the bulk material at varied strain-rates and temperatures (to 473K) to determine the underlying deformation mechanisms. Stress exponents of about three and seven were observed at low and high stresses, respectively, and very low activation energies for creep (about 16.7 and 37.7 kJ/mole) were noted. A maximum ductility of about 350% was noted at ambient temperature. Creep tests performed in the same temperature regime also showed two distinct regions, albeit with slightly different exponents (three and five) and activation energy (about 54.4 kJ/mole). Ball indentation tests were performed on the shoulder portions of the creep samples (prior to creep tests) using a Stress-Strain Microprobe@ (Advanced Technology Corporation) at varied indentation rates (strain-rates). The automated ball indentation (ABI) data were at relatively high strain-rates; however, they were in excellent agreement with creep data, while both these results deviated from the tensile test data. Work is planned to perform creep at high stresses at ambient and extend ABI tests to elevated temperatures.