Abstract
In this study the impact of adding 0.3 wt% ZnO nano-sized particles into Sn–5wt%Sb–1.5wt%Ag (SSA) lead free solder (LFS) was investigated for microstructure, thermal and tensile stress strain characteristics. The microstructure of both the plain and composite LFS was examined by utilizing the optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The addition of ZnOnano-sized particles drastically changed the microstructure and improved the tensile response of SSA LFS. The microstructure investigations showed the formation of the intermetallic compounds (IMCs) Ag3Sn and SnSb. Sizes of the formed IMCs were found finer in the ZnO-contained solder. In this work the alloy under investigation exhibited better tensile response with the refined IMC particle. Thermal analysis of the composite solder revealed a slight decrease (0.08 °C) in freezing point, low pasty range (6.55 °C) and low degree of undercooling (3.39 °C). These findings are expected to supply a correct guideline and reference in producing of electronic packages.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
