Tensile Characteristics of Mechanical Lap Joints Between Commercial ReBCO Tapes With Various Interlayer Materials

Abstract

In this work, the mechanical lap joint of commercial ReBCO tape from SHSC is prepared. The tape is reinforced with stainless steel bar in both side to reduce the effect of bending moment in the joint tensile test. We use Indium and GaInSn as interlayer material, respectively, and different pressures are applied on the joint by jig during testing. The relationship between joint resistance and applied tensile stress was measured at 77 K. The results shows that for all measured joints under pressure, the voltage rise duo to tensile stress is small at first and then sharply grows until a certain value of stress is reached. The maximum tensile stress is higher for the joint which has lower resistance. Comparing two types of mechanical lap joints with Indium and GaInSn, the former joint shows smaller dispersion on joint resistance than the latter under pressure above 40 Mpa. It is also shown that the joint with Indium can tolerate higher tensile stress than the joint with GaInSn by using the Weibull distribution function analysis.