Tensile and Fracture Behaviour of Sn/Pb Solder Affected Aluminium Subjected to Post-Deformation Ageing

Abstract

An efficient assessment of the mechanical characteristics of waste/scraped aluminum under a variety of operating circumstances is crucial to the exploration of its potential for reuse. In this regard Sn/Pb solder affected aluminum is subjected to post-deformation and ageing in order to investigate its effect on tensile and fracture behaviour. To isolate the individual effects pure Al, binary Al-Sn and Al-Pb alloy samples are taken simultaneously. Cold rolled by 80% and aged at different temperatures are then tensile tested at room temperature with a different strain rate. Results are the solder affected samples improved in strength through solid solution strengthening whereas tin performed better than lead because Sn has a different BCC crystal structure than that of FCC Al and Pb. Quantitative analysis indicates that at the peak aged condition the strength of pure aluminium is improved by 21%, 9% and 29% when affected by Sn, Pb and Sn-Pb solder respectively. Tin forms various intermetallics with different impurities hence there is some ageing response. These precipitates have an effect on the strain rate and accelerate the tensile strength. The effects of elements on the reduction of impact strength are noticeable. Minor added alloys show relatively dense grain boundaries for the presence of different elements. Such elements are visible on the fracture surface, which inhibits dislocation movement and ensures high strength. IUBAT Review—A Multidisciplinary Academic Journal, 7(1): 186-201