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Abstract
Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effect of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties were examined. Tensile strength increases with increasing strain rate regardless of temperature investigated. For elongation, the effect of temperature on it is negligible although it slightly increases with increasing strain rate. The low cycle fatigue life of Sn-5Sb obeys by the Manson-Coffin’s equation. The effect of temperature on the fatigue life is negligible in the temperature range from 25 oC to 150 oC. In the low cycle fatigue test with a high total strain range of 4%, cracking at phase boundary mainly occurs regardless of temperature investigated. In the case of a low total strain range of 0.4%, ductile fracture mainly occurs, and cracking at phase boundary with generation of grooves also occurs at high temperature.
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