Abstract
Temporary bonding using paper inserted polypropylene carbonate (PPC) layer is demonstrated. The inserted paper layer can absorb photo acid generator (PAG)-induced acid and protect the substrate. Large improvements of bonding strength are achieved using paper inserted PPC layer. Especially, the bonding strength is much higher than that of PPC/PAG-PPC bonding for tissue paper. The results show that the paper fibers can absorb decomposed PPC and PAG-induced acid, thus protecting the substrate
Highlights
Silicon wafer is the fundamentals of semiconductor industry [1,2,3]
To achieve the above requirements, we propose photo acid generator (PAG) loaded polypropylene carbonate (PPC) debonding at room temperature without any solvent based or ultraviolet (UV) treatment [9]
PPC is less consumed and there is PPC remained beneath the paper layer, the substrate is protected and the bonding strength is improved
Summary
Particular, the application of thin silicon wafers is an enabling technology for modern electronics as reduced wafer thickness integration enables shorter processing times and less cost [4,5,6]. All of this is advantageous for a low package height for chip cards, the requirement for higher power, and the search for System-in-a-Package (SiP) using chip stack methods. To achieve the above requirements, we propose photo acid generator (PAG) loaded polypropylene carbonate (PPC) debonding at room temperature without any solvent based or ultraviolet (UV) treatment [9].
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