Abstract
Finite element computer simulation was used to calculate the temperature distribution of an integrated circuit in the System-in-Package (SiP) produced with hybrid chip 2D mounting technologies such as flip chip and wire bonding. Technical recommendations on the choice of the mold compound are proposed, taking into account the continuous layer of the mold compound separating the active elements and the heat sink radiator.
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Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
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