Abstract
We analyze the change of angular gain and vibration frequency of the solid-state wave gyroscopes as a result of geometry perturbations due to thermal expansion. We analyze sensitivity of the device to the thermal expansion effects by an isoparametric finite-element analysis method, and we analyze the sensitivity to thermal changes in the material properties assuming a linear dependence on temperature. We quantify these sensitivities for common device geometries, and use our analysis as the basis for a local optimization problem that minimizes the temperature sensitivity as a function of device shape.
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