Abstract

Abstract. This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

Highlights

  • The demand for increasing performance and at the same time decreasing feature size in modern CMOS technologies lead to higher power densities influencing chip temperature

  • This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping

  • This paper presents an approach for emulating an ASIC temperature monitoring system (TMon) for Tightly-Coupled Processor Array (TCPA) tiles of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping

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Summary

Introduction

The demand for increasing performance and at the same time decreasing feature size in modern CMOS technologies lead to higher power densities influencing chip temperature. The workload is distributed in a non-uniform way in different circuit blocks leading to local temperature hot spots. This can greatly affect the lifetime and the reliability of a chip (Brooks et al, 2007; Semenov et al, 2006). This paper presents an approach for emulating an ASIC temperature monitoring system (TMon) for Tightly-Coupled Processor Array (TCPA) tiles of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. A closed-loop control system is formed, including monitors, run-time support system, hardware management unit and applications. The interaction of hardware, run-time support system and application during resource allocation, taking monitoring data into account, has to be verified and tested. An emulation of the behaviour of an ASIC TMon on the FPGA platform is required

Related work
ASIC temperature simulation for TCPAs
Simulation framework
Evaluation of TCPA usage scenarios
Emulation of TCPA temperature monitor system
Emulation principle
Results
Usage example
Conclusions
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