Abstract
Packaging and die bonding of conventional micro‐electro‐mechanical‐systems (MEMS) and semiconductor devices include separate dispensing, mounting and heating curing. A novel die bonder's work stage and temperature control method are proposed so that dispensing, mounting and heating curing can be completed at the same station. This paper introduces the working principle of the thermopile sensor and the requirements for temperature change during die bonding, analyses the main structure and working process of the novel die bonding stage, and uses commercial finite element analysis software to evaluate the temperature field of the novel die bonding stage and devices during the process of heating, holding and cooling to provide process guidance for accurate temperature control of die bonding. Dispensing, mounting and heating curing are integrated in the same station, avoiding the position error of devices when transferring, reducing the number of equipment and floor area, and effectively saving production costs. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEJ Transactions on Electrical and Electronic Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.