Abstract
Low cycle fatigue tests on as-cast Sn–Pb eutectic solder (63Sn–37Pb) were carried out under various temperatures (20, 85, 120 °C). The relationship between stress range and inverse temperature followed the Dorn’s equation with the activation energy in the range of 37–47 kJ/mol. Multiple surface cracks and propagating cracks predominantly occurred in an intergranular manner along the colony boundaries. Propagation of a stage II crack at various temperatures could be characterized by C ∗ -parameter.
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