Temperature dependence of residual stress in TiC coated Mo

Abstract

The effects of fabrication temperature and heat treatment on the residual stress in TiC coated Mo have been studied by using X-ray diffractometry. TiC coatings on Mo single crystal substrates with (100) and (111) surfaces were carried out with the Activated Reactive Evaporation (ARE) method. It was found that all Mo substrates measured show tensile residual stresses, and their values decrease as the fabrication temperature increases from 300 to 700°C. On the other hand, TiC films measured showed compressive residual stresses, for both TiC/Mo(100) and TiC/Mo(111) specimens. These compressive stresses also decreased with increasing the fabrication temperature. The residual stresses measured were higher in TiC/Mo(100) than in TiC/Mo(111). It was found that the compressive stresses in as-grown TiC films change to the tensile stresses after annaling at 1700°C for 30 min. The preferred orientations of TiC films were observed to depend on the fabrication temperature. However, no epitaxial growth of TiC films was found as far as the present experiment was concerned.