Abstract
In nanoimprint lithography (NIL), molds are in direct contact with replication materials. Furthermore, the glass transition temperature is around 100–200 °C in thermal NIL. We examined the temperature dependence of a release effect for the antisticking layer of a self-assembled monolayer with a fluoropolymer by scanning probe microscopy (SPM). We measured the contact angle and frictional force of the antisticking layer with and without annealing. The contact angle decreases and the frictional force increases at annealing temperatures greater than 500 °C. We analyzed the chemical composition of the antisticking layer with and without annealing by X-ray photoelectron spectroscopy (XPS). From the obtained measurement results, the CF3 and CF2 peaks of the antisticking layer disappeared after annealing at temperatures greater than 500 °C. These results show that the antisticking layer annealed at temperatures less than 500 °C has a sufficient release effect.
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