Temperature dependence of isothermal curing reaction of epoxy resin studied by modulated differential scanning calorimetry and infrared spectroscopy

Abstract

The isothermal curing reaction of bisphenol A diglycidyl ether epoxy (BADGE) resin with dimethyl diamino methane (DDM) hardener was investigated by means of modulated differential scanning calorimetry (MDSC) and infrared (IR) spectroscopy at 90, 100 and 120 °C.It was confirmed that the behavior of the bands assigned to the epoxy group, ether group, secondary amine and tertiary amine were different depending on temperature. At stoichiometric amounts of DDM and BADGE, the reaction at 90 and 100 °C compared with that at 120 °C, the oxirane or glycidyl group of epoxy resin and the secondary amine group were left even if reached at the end point of the reaction, and those reaction proceed as diffusion control continues longer. The reaction between 90 and 100 °C, it was different from the reactivity of the epoxy resin, various amino groups and ether group. Hence, the cured epoxy resin had a different composition. Moreover, it was also verified that the reactivity of the various amino groups and the etherification were difference, therefore, it was suggested that the cross-linkage construction of the cured resin at different temperature was different.