Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach

Abstract

This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.