Abstract
The complete sets of material constants of <001>-oriented two wafers (HP: high-performance and LP: low-performance) using direct current poling (DCP) and alternating current poling (ACP) were investigated. ACP can improve the longitudinal and transverse piezoelectric properties (about 20% increase in both d31 and d33) and decrease the shear properties (about 40% decrease in d15). The compliance constants SEij of both ACP HP and LP samples have the similar change trend (the absolute of SE11, SE12, SE13, SE33, SE66 increasing, the SE44 decreasing), while most stiffness constants CEij of both ACP HP and LP samples show the different change trend. The values of CE11, CE12, CE13 of ACP LP samples increase by at least 50% while ACP HP samples decrease by about 5%. As temperature elevated, the dielectric properties (εT11/ε0, εT33/ε0), piezoelectric properties (d15, d31, d33) and electromechanical coupling coefficients (k15, k33) increased steadily, while the k31 keep stable.
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