Abstract
In this work, we have fabricated a dielectric based soil moisture sensor with multi-sensing points (SMSMSP), which comprises of five interdigitated electrodes on both side of printed circuit board (PCB). Thickness of the fabricated SMSMSP is about 1.6 mm and light weight (0.1 kg), hence easy to carry for the field measurements. Further, we calibrated the sensor for different soil dry bulk density and observed that the time taken by the soil moisture to penetrate from soil surface till 25 cm is around 10 mins and 57 mins when density is maintained at 1.1 gm/cc and 1.3 gm/cc, respectively. We observed that the SMSMSP output changes only by 2.7 % when the ambient temperature varies from 20 °C to 60 °C. Both lab and field deployments results indicate that measured soil water content using SMSMSP at different depths is within ± 3% when compared with the gravimetric method.
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