Abstract
Commercially available polycrystalline nickel (grain size: 30 µm) and electrodeposited nanocrystalline nickel (grain size: 30 nm) were analyzed for the effect of stress-induced heat generation during plastic deformation at room temperature. Tensile coupons in conformance to ASTM E8 standard were tested at a strain rate of 10-1/s to record the amount heat dissipated using a high resolution infrared detector. The maximum temperature increases recorded for nanocrystalline and polycrystalline nickel close to sample fracture were 58°C and 70°C, respectively. Grain growth in nanocrystalline nickel due to stress-induced heat generation is unlikely since the maximum temperature during deformation is below the previously reported onset temperature for grain growth in nanocrystalline nickel.
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